Thyristor Mounting Questions and Answers
Power Electronics Objective Questions & Answers
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Inter-digitating of gate-cathode regions in SCR devices improves the
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In the ___________ type of mounting the SCR is pressed between two heat sinks
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For low power SCRs (about 1 Ampere current) _____________ type of mounting is used
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The total thermal resistance between junction and ambient θjA is 10°C/W. θjc is 2°C/W. θcs is 4°C/W. θsA = ?
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Heat dissipation from heat sink mainly takes place by
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The sink to ambient thermal resistance of SCR θsA
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Pav x (θjc + θcs + θsA) =
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The dv/dt rating of SCR can be improved by using
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The usual way to accomplish higher gate current for improved di/dt rating is by using
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Which of the following thermal resistance parameters depends on the size of the device and the clamping pressure?
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Thyristor Mounting
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