What are the types of MOSFET devices available?

Critical defects per unit chip area is ________ for a MOS transistor.

What is used to higher the speed of operation in MOSFET fabrication?

Which of the following plays an important role in improving device performance of MOSFET?

The full form of MOS is

Which insulating layer used in fabrication of MOSFET?

A technique used to reduce the magnitude of threshold voltage of MOSFET is the

MOS is being used in

Find the sequence of steps involved in fabrication of poly silicon gate MOSFET?

Step 1: Entire wafer surface of a Si3N4 is coated and is etched away with the help of mask to include source, gate and drain.
Step 2: The contact areas are defined using photolithographic process.
Step 3: Selective etching of Si3N4 and growth of thin oxide.
Step 4: The deposition of poly silicon gate.
Step 5: The growth of thick oxide is called field oxide and P implantation.
Step 6: The metallization and interconnection between substrate and source.

Why MOSFET is preferred over BJT in IC components?